2D/3D AOI Inspection Solution - 주식회사 로이드

2D/3D AOI Metrology & Inspection Solution

주식회사 로이드는 대만 CMIt의 공식 대리점입니다.

2D/3D AOI Metrology & Inspection Solution

주식회사 로이드는 대만 CMIt의 공식 대리점입니다.

CMIt

CMIt의 광학 측정 장비는 높은 수준의 2D/3D 검사 측정이 가능한 AOI 장비입니다.

2D Inspection – TLI & PLR
TLI (Total Light Integration)	PLR (Photoluminescence)
Designed especially for multi-layer RDL Minimizing underlying layer interference Suppressing metal surface roughness	Fluorescence inspection image contrast and high throughput Optimized for detecting residual organic materials in high aspect-ratio structures

2D Inspection – TLI & PLR

TLI (Total Light Integration)

PLR (Photoluminescence)

Designed especially for multi-layer RDL
Minimizing underlying layer interference
Suppressing metal surface roughness

TLI Inspection

Fluorescence inspection image contrast and high throughput
Optimized for detecting residual organic materials in high aspect-ratio structures

PLR Inspection

3D Metrology

Full BH/COP Measurement
Thin Film THK Measurement
Interferometric principle
Die Shift Measurement

Confocal (CMIt)

Confocal Measurement

Bump Height
Die Warpage / Die Shift
Wafer Warpage

Software & AI Solution
MOON Multi Orientation Optical Navigation Moon System architecture and applications	Inspection Hybrid Process ACME – All-in-One AI Model Development Platform Quick Image Labeling – 500 pcs < 5 min Friendly Training UI Immediate Model Test RADON – AI Re-judge System Reduce machine computation load Service Multi Machine Support Production Data Analysis and Review Reduce manual review workload

Software & AI Solution

MOON
Multi Orientation Optical Navigation

Moon System architecture and applications

Inspection Hybrid Process

AI Inspection Flow

ACME – All-in-One AI Model Development Platform

Quick Image Labeling – 500 pcs < 5 min
Friendly Training UI
Immediate Model Test

RADON – AI Re-judge System

Reduce machine computation load
Service Multi Machine
Support Production Data Analysis and Review
Reduce manual review workload

Argus ㅣ Multi-layer RDL (Interposer) Inspection System

Argus 시스템은 다층 RDL Interposer 구조에 최적화 되어 정확한 결함 감지 및 측정을 보장 합니다.
혁신적인 광학 설계와 알고리즘을 갖춘 Argus는 하부층의 간섭을 효과적으로 최소화 하여 중요한 결함을 정밀하게 식별하여 advanced Packaging의 엄격한 요구사항을 충족 합니다.

Product Feature

· Support 6″, 8″, 12″ WF & 310x310mm Panel
· Wafer Thickness Range : 400~2500㎛.
· TLI for mult-layer RDL (10P10M, L=1.4㎛)
· Optional μBump, COP metrology (Round bump CD<8㎛) metrology
· Optional PLR, Optional fluorescence inspection
· Tool matching
· Maximum die size : 285 x 285mm.
· 2D Sensitivity
BF : 0.7㎛, DF : 0.25㎛
· 3D Accuracy
Resolution : 20nm, Accuracy : 80nm

Phantom ㅣ Large Panel Defect Inspection + 3D Bump Metrology

Phantom 시리즈는 검증된 Argus 기능을 대형 패널 application으로 확장 합니다.
팬아웃 패널-레벨 패키징, RDL 패널 어플리케이션 및 패널 레벨 인터포저/브리지 구조를 포함 합니다.

Product Feature

· Panel Size Support : 510×515, 600×600, 700x700mm.
· Panel Thickness Range : 400~4000㎛.
· High-warp capability : Handle panels w/I warpage < 10mm.
· TLI for mult-layer RDL (10P10M, L/S=2/2㎛)
· Optional μBump metrology.
· Optional fluorescence inspection.
· Mult-parameter scanning within a single cycle
Focus, magnifcation, ilumination, sensitivity, and detection engines.

TopoX ㅣ 3D Surface profile and Thickness Metrology

Product Feature

· Support 6″, 8″, 12″ Full Wafer
· 3D surface profiling and thickness measurement.
· Bow, Warp, TTV, LTV, Thickness
· High Throughput
· 3D topography classification
· 3D Resolution : 5㎛
· 3D Accuracy : 30nm

Buffalo ㅣ 2D Die Saw Inspection

Product Feature

· Multi-mag inspection & metrology
· BF, DF and multi-wavelength illumination
· Chipping, crack, scratch, and probing mark inspection
· Non-patterning glass wafer insp.